Surface mount technology (Surface Mount Technology; SMT), also known as surface mount technology, is a electronic components are soldered on the printed circuit board or substrate surface of the package combination, belonging to an electronic component assembly technology. General so-called SMT bonding technique used in printed circuit board with electronic components, but the same principle to continue to expand its application areas, such as applications in the semiconductor industry by the IC packaging technology, used in liquid crystal displays, compared with LCD packaging technologies. Electronic components assembled in the past is on plug-in package, wire type (Lead Type) gold needle electrodes inserted in the printed circuit board through-hole, re-welded and then technology. However, with small, lightweight, fast, high-performance requirements of surface mount so gradually replaced by a plug-welded joints principle in recent years, the printed circuit board assembly technology have made great contributions.

SMT machine equipment in the general process will be automated surface mount technology(Surface Mount Technology, SMT)). SMT is a small parts or precision machine parts, this partbecause of the very sophisticated, you can not use artificial means to plug-ins, so it is necessary with automatic SMT machines, parts mount to the PCB printed circuit board. SMTrely on computer programs to control the order and location of parts, the technician responsiblefor doing the preparation of the parts (disk material, coil) input of the SMT program, machine maintenance, machine troubleshooting.

PCB assembly workflow Video:

2.PCB widely used in information, communications, consumer electronics, aerospace, military and industrial equipment, etc. in different industries.
Classification according to their material and flexible can be divided into rigid boards and soft boards, if its conductive layers can be broken down into single, double and multilayer boards. Part of the material, the main raw material of the PCB substrate, copper foil and chemicals in the substrate part by the different materials can be divided into the paper substrate, the composite substrate, glass fiber cloth material and the manufacture of soft board substrate Polyester Polyamide and other categories. Special substrate section, including the different types of metal substrates, thermoplastic substrate and the ceramic substrate.

3.Standard operating procedures (Standard Operation Procedure, SOP) refers to recurrent or repetitive tasks, such as a variety of inspection, operation, operations, etc., to make the program agreed to the implementation of the process in more detail description of a written document.The aim is to reduce human error; to reduce the defect rate; high quality assurance management system (quality assurance).

4.The so-called clean room particles in the air space control, the construction of a special closed building.
The production behavior of the technology industry needs more than in the clean room (or clean room), Department of the use of special air handling equipment to air particles in the environment, micro-organisms, temperature, humidity, pressure, pressure flow pattern, air movement and other environmental factors controlled within the standard range, in order to maintain product quality.

Surface mount technology production and manufacturing processes

Surface mount manufacturing process technology to produce: